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Latest filing published 15 Jun 2021 for 通合科技. Read the official filing
Our data holds just one disclosure by 董顺忠, dated 15 June 2021, reporting an open-market sale worth €67k in 通合科技. Further filings will be added here. Source: insider filings from SSE / SZSE (CSRC). Past trades are no guide to future returns.
Open company profiles for insider transactions, fundamentals and analyst consensus when available.