Amkor Technology, INC.: insider trades · United States · SEC (Form 4)

About Amkor Technology, INC.

Amkor Technology, Inc. (Nasdaq: AMKR) is a key name in the semiconductor supply chain and one of the largest outsourced semiconductor assembly and test (OSAT) providers headquartered in the United States. The company was founded in 1968 and is based in Tempe, Arizona, in the United States. Amkor’s core role is to help chipmakers, foundries, and electronics OEMs convert wafers into finished, test-validated components ready for integration into end products. That makes it an essential manufacturing partner in an industry where packaging and testing are increasingly central to performance, power efficiency, thermal management, and reliability. ([ir.amkor.com](https://ir.amkor.com/)) Amkor’s business is broader than traditional back-end assembly. Its portfolio includes advanced packaging, wafer-level processing, system-in-package solutions, wafer bump, wafer probe, back-grind, package design, system-level test, final test, and drop shipment services. This service stack allows the company to support customers across different chip types and application requirements. In practice, Amkor serves semiconductor companies across smartphones, data centers, artificial intelligence, automobiles, wearables, communications, computing, and industrial markets. The company’s model is built around high technical content, long qualification cycles, and close customer integration rather than commodity manufacturing. ([ir.amkor.com](https://ir.amkor.com/static-files/59a11cc8-a217-42dd-9f52-5351ff173c74)) From a competitive standpoint, Amkor highlights several structural strengths: a large and geographically diversified operating base, a long track record in high-volume manufacturing, and deep relationships with leading semiconductor customers. The company describes itself as the world’s largest U.S.-headquartered OSAT, and it has positioned itself around advanced packaging solutions for high-growth markets such as AI and high-performance computing. That strategic focus matters because next-generation chips increasingly require sophisticated packaging architectures to deliver more bandwidth, better thermal characteristics, and higher integration density. ([ir.amkor.com](https://ir.amkor.com/static-files/59a11cc8-a217-42dd-9f52-5351ff173c74)) Recent developments have been particularly important. In October 2025, Amkor announced a new advanced packaging and test campus in Arizona, with planned investment expanded to $7 billion across two phases, underscoring its commitment to strengthening U.S. semiconductor manufacturing capacity. In early 2026, the company reported record first-quarter sales, approved a $300 million share repurchase authorization, and continued to communicate an active capital allocation and investor-engagement agenda. It also announced an Investor Day in New York City for May 21, 2026. For investors in Europe looking at a U.S.-listed semiconductor infrastructure name, Amkor stands out as a globally diversified, technologically relevant industrial platform tied to the long-term growth of advanced chips. ([ir.amkor.com](https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced))